New PDF release: Advanced Packaging
By Pepin Press
STRUCTURAL package deal layout is a chain of books, packed with excellent, a hundred% structurally exact, scalable packaging templates. All designs are prepared for fast use and illustrated with 2-D and 3-D structural drawings and pictures. The CD includes the templates in a variety of codecs together with EPS and PDF. additionally incorporated is a demos model of Illustrator?-Plug-Ins that offer expert package deal layout probabilities. This quantity ? complicated PACKAGING ? comprises two hundred extra advanced designs.
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Additional info for Advanced Packaging
5 µm at 3 sigma, and 500-uph placement with a 7-sec. cycle time. Applications include P-side down laser-diode attachment, silicon bench (V-groove) placement, high-density RF power transistors, and ultra-fine-pitch hybrid assemblies. The bonder’s footprint is 1m2, machine measurement is 38 × 48 in. , and bond area is 12 × 6 in. 1 µm. Six programmable pick tools on a bi-directional rotating tool turret can be changed on-the-fly, and the machine can be customized for automated waffle pack loaders, tape-and-reel feeders, or gel-pack loaders.
So, when developing solutions for the electronic industry, we follow this basic principle. Our innovative products meet the highest standards of quality, economic efficiency and functionality. You see, we all have the same tastes. Please visit our booth at Semicon West 2005 San Francisco, Booth 5120. Zoom In Zoom Out Front Cover Search Issue Next Page A BEMaGS F 5/25/05 12:26:54 PM Advanced Packaging ï ï u u THE Previous Page back-end Contents Zoom In Zoom Out Front Cover Search Issue Next Page A BEMaGS F PROCESS hesive to match the stress environment.
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