New PDF release: Advances in Rapid Thermal and Integrated Processing
By Fred Roozeboom (auth.), Fred Roozeboom (eds.)
Rapid thermal and built-in processing is an rising single-wafer expertise in ULSI semiconductor production, electric engineering, utilized physics and fabrics technology. the following, the physics and engineering of this know-how are mentioned on the graduate point. 3 interrelated parts are coated. First, the thermophysics of photon-induced annealing of semiconductor and similar fabrics, together with primary pyrometry and emissivity matters, the modelling of reactor designs and procedures, and their relation to temperature uniformity. moment, strategy integration, treating the advances in easy gear layout, scale-up, built-in cluster-tool gear, together with wafer cleansing and built-in processing. 3rd, the deposition and processing of skinny epitaxial, dielectric and steel motion pictures, protecting selective deposition and epitaxy, built-in processing of layer stacks, and new components of strength program, corresponding to the processing of III-V semiconductor constructions and skinny- movie head processing for high-density magnetic facts storage.
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In this paper we will only consider the behaviour of materials which have isotropic optical properties, which is to say that the optical response within the solid does not depend on the direction of propagation or polarization of the electromagnetic wave. We will also restrict the discussion to materials with a relative magnetic permeability of unity. These restrictions greatly simplify the analysis, and do not exclude any important materials from the discussion, as far as RTP is concerned. 2 OPTICAL PROPERTIES The optical response of a material can be described using a number of different properties, which are interrelated.
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